Huawei chips
Huawei chips

Since the end of 2016 the sector is awaiting the figure of 7 nanometers as the next goal to be reached for the manufacture of transistors that will be responsible for all the necessary calculations that will occur within the mobile phones of the future.

While we wait for production of the A12, the Apple processor called to be the first to go into production with that size, the first speed specifications of the latest generation Kirin, also 7 nm, are filtered . This is the Kirin 980 chips that are expected to preside over the next Huawei flagships, among others.

Many are those who believe that we will see the presentation of the new generation of processors, again and as it happened with the Kirin 970, during the IFA celebration in Berlin, which will take place between the end of August and the beginning of September.

One of the great innovations presented by the Kirin 970 last year, among its specifications, was a unit dedicated exclusively to artificial intelligence, an NPU (Neural Processing Unit) that fed the image recognition capabilities, augmented reality and attendees smart

So far, Huawei semiconductor manufacturers, under the name of HiSilicon, are talking about a next generation of chips much faster and many smaller. If the jump from Kirin 960 to Kirin 970 was 6 nanometers (from 16 nm to 10 nm), this time it is expected that the processors will reduce 3 nm and reach the figure of 7 nanometers.

The new HiSilicon speed

The reduction of processors, as always, is accompanied by a jump in performance and efficiency: less energy consumption, more calculation power and a processing speed that reaches, according to different sources in Chinaat 2.8 GHz.

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According to these same sources, the Kirin 980 processors will have eight cores and all of them will reach that 2.8 GHz. On the one hand, it will be four Cortex-A77 that will be responsible for the main processing taskswhile the rest, four Cortex-A 55 , they will have support and stability functions.

The processing capacity of the NPU that will accompany the Kirin 980 will be improved, gaining in fluidity thanks to the latest Cambricorn technology, capable of reaching 5 trillion calculations per watt of power.

To finish closing rumors of performance, the graphics processing unit (GPU) that HiSilicon will introduce in the Kirin 980 will be 1.5 times faster than the current capacity of the Adreno 630 that is included in the Qualcomm Snapdragon 845.

At the end of the year it is expected that we will be able to see the first phones with the new chips and that is when we will be able to test their calculation capabilities.

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